Permabond® ET500 is a two-part fast-setting epoxy adhesive which bonds to a wide variety of substrates such as wood, metal, ceramics and some plastics and composites. It cures rapidly at room temperature to give handling strength in approximately 5 minutes. This product is ideal for general purpose bonding. It is typically used for small component assembly and is suitable for applications that require a clear bond line.
Surface Preparation Prior to Using Permabond ET500
Surfaces should be clean, dry and grease-free before applying the adhesive. Use a suitable solvent (such as acetone or isopropanol) for the degreasing of surfaces. Some metals such as aluminium, copper and its alloys will benefit from light abrasion with emery cloth (or similar), to remove the oxide layer.
How To Use Permabond ET500 Syringe
1) Remove cap and dispense material until both sides are flowing out using the syringe method. No gun is required.
2) Then attach the static mixer nozzle to the end of the cartridge and dispense out until adhesive is coming out of the nozzle.
3) Apply the adhesive material to one of the substrates.
4) Join the parts together within 2-3 minutes due to fast curing nature of the product. It's essential to join the parts within the usable pot life of mixing the two epoxy components.
5) Note that large quantities and/or higher temperatures can decrease the usable pot life.
6) Apply pressure to the assembly, typically by clamping, until handling strength is achieved.
7) Full curing of the adhesive will occur after 24 hours at 25°C (77°F). If needed, heat can be used to accelerate the curing process.
All information on this page offers guideline information. This does not constitute a specification and advice may change from time to time. Please get in touch if you require specific advice.
